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  2009-03-11 1 DSL70 silicon tvs diodes array ? esd / transient protection of e.g. adsl, vdsl, isdn, wan, lan, i2c bus, microcontroller inputs, video and other high-speed data lines in telecom applications: iec61000-4-2 (esd): 15 kv (air / contact) iec61000-4-4 (eft): 4 kv / 80 a (5/50 ns) iec61000-4-5 (lightning): 27 a (8/20 s) ? very low capacitance ? extremly low reverse current < 5 na ? pb-free (rohs compliant) package ? qualified according aec q101 DSL70 2 1 d 2 d 1 4 3 d 3 d 4 type package configuration marking DSL70 sot143 2 channel, rail to rail e4s maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit esd contact discharge per diode 1) v esd 15 kv peak pulse current ( t p = 8 / 20 s) 2) i pp 27 a peak pulse power ( t p = 8 / 20 s) p p k 245 w operating temperature range t o p -55...125 c storage temperature t st g -65...150 1 v esd according to iec61000-4-2 2 i pp according to iec61000-4-5
2009-03-11 2 DSL70 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. characteristics - reverse working voltage v rwm - - 50 v reverse current v r = 50 v i r - - 5 na forward clamping voltage 1) i pp = 1 a, t p = 8/20 s i pp = 10 a, t p = 8/20 s i pp = 24 a, t p = 8/20 s i pp = 27 a, t p = 8/20 s v fc - - - - 1 2.5 5 6 1.5 3 6 9 v diode capacitance v r = 0 v, f = 1 mhz, between i/0 and gnd v r = 0 v, f = 1 mhz, between i/0 pins c t - - 2.5 1.25 5 2.5 pf 1 i pp according to iec61000-4-5
2009-03-11 3 DSL70 power derating curve p pk = ? ( t a ) 0 25 50 75 100 c 150 t a 0 10 20 30 40 50 60 70 80 90 110 % of rated power or i p forward clamping voltage v fc = ? ( i pp ) t p = 8 / 20 s 0 5 10 15 20 25 a 35 i pp 0 1 2 3 4 5 6 v 8 v fc diode capacitance c t = ? (v r ) f = 1mhz 0 5 10 15 20 v 30 v r 0 1 pf 3 c t i/o to gnd
2009-03-11 4 DSL70 application example DSL70 dual channel, rail to rail configuration protected signal line protected signal line the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible. pin 1 should be connected directly to a ground plane on the board . connector esd sensitive device i/o i/o 2 1 d 2 d 1 4 3 d 3 d 4 vcc
2009-03-11 5 DSL70 package sot143 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel rf s 2005, june date code (ym) bfp181 type code 56 pin 1 0.8 0.8 1.2 0.9 1.1 0.9 1.2 0.8 0.8 0.8 -0.05 +0.1 1.9 1.7 0.1 2.9 +0.1 -0.05 0.4 0.1 max. 12 3 4 0.25 m b 0.1 1 10? max. 0.15 min. 0.2 a m 2.4 0.15 0.2 10? max. a 1.3 0.1 0...8? 0.08...0.15 2.6 4 3.15 pin 1 8 0.2 1.15 b manufacturer
2009-03-11 6 DSL70 edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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